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Company
TE Connectivity
Description
2198232-1
Bill of material
2198232-1
Part Number
2198232-1
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TE Internal #
2198232-1
TE Internal Description
SFP+ Enhanced 1x2, PCI Heatsink, LP
Form Factor
SFP+
Product Type
Cage Assembly
Cage Type
Ganged
Thermal Accessory Type Included
Heat Sink
Integrated Lightpipes
No
Connector System
Cable-to-Board
Sealable
No
Connector & Contact Terminates To
Printed Circuit Board
Port Matrix Configuration
1 x 2
Lightpipe Configuration
Dual Round
Lightpipe Style
Standard
Lightpipe Profile
Standard
Number of Ports
2
Data Rate Max
16 Gbs
Heat Sink Style
Pin
Heat Sink Height Class
PCI
Heat Sink Height
4.2 mm [ .165 in ]
Termination Method to Printed Circuit Board
Through Hole - Press-Fit
PCB Mounting Style
Through Hole - Press-Fit
Connector Mounting Type
Board Mount
Cage Material
Nickel Silver
PCB Thickness
2.25 mm [ .089 in ] Recommended
Tail Length
2.05 mm [ .081 in ]
Operating Temperature Range
-55 - 105 C [ -67 - 221 F ]
For Use With Pluggable IO Products
SFP+ SMT Connector
Pluggable IO Applications
SFP+ Enhanced
Circuit Application
Signal
Heat Sink Compatible
Yes
Packaging Method
Box & Tray, Tray
EMI Containment Feature Type
External Springs
Included Lightpipe
Yes
Previews
3D
2D
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