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Company
TE Connectivity
Description
2170684-1
Bill of material
2170684-1
Part Number
2170684-1
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TE Internal #
2170684-1
TE Internal Description
SFP+ Enhanced 1x4, PCI Heatsink, LP
Form Factor
SFP+
Product Type
Cage Assembly
Cage Type
Ganged
Thermal Accessory Type Included
Heat Sink
Connector System
Cable-to-Board
Sealable
No
Connector & Contact Terminates To
Printed Circuit Board
Port Matrix Configuration
1 x 4
Number of Ports
4
Data Rate Max
16 Gbs
Heat Sink Style
Fin
Heat Sink Height Class
Networking Short
Heat Sink Height
4 mm [ .157 in ]
Termination Method to Printed Circuit Board
Through Hole - Press-Fit
PCB Mounting Style
Through Hole - Press-Fit
Connector Mounting Type
Board Mount
Cage Material
Nickel Silver
PCB Thickness
2.25 mm [ .089 in ] Recommended
Tail Length
2.05 mm [ .081 in ]
Operating Temperature Range
-55 - 105 C [ -67 - 221 F ]
For Use With Pluggable IO Products
SFP+ SMT Connector
Pluggable IO Applications
SFP+ Enhanced
Circuit Application
Signal
Heat Sink Compatible
Yes
Packaging Method
Box & Tray
EMI Containment Feature Type
External Springs
Included Lightpipe
No
Previews
3D
2D
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